BGA测试插座,BGA老化测试座

http://www.lingmei.com.cn/procenter-bga.htm分球形出脚(SMT)和针形出脚两种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.Over ViewTwist lock sockets are available for any chip size and grid pattern. Available in SMT, thru-hole and solderless compression type versions. Compact design. Custom versions available on request. Twist-Lock Type BGA Socket Data Sheet MECHANICAL DATA Contact life: 10,000 cycles min.Retention System life: 1,000 cycles min.Solderability : Exceeds MIL-STD-202 Method 208Individual contact force: 40 grams max.Max. torque for retentionscrews: up to 800 pins = 7cNm or 10 oz-inchas of 800 pins = 7cNm to 10cNm or 10 oz to 14 oz-inchMATERIALInsulator (RoHS Compliant): High temp plastic or epoxy FR4Terminal (RoHS compliant): BrassContact (RoHS compliant): BeCuELECTRICAL DATAContact resistance:<100 mΩCurrent rating:500 mA max.Insulation resistance:at 500V DC  100 MΩ if 0.50 to 0.80mm pitch                  500 MΩ 1.00mm pitch upwardsBreakdown voltage: at 60 Hz   500V min.Capacitance:<1 pFInductance:<2 nHOperating temperature:-55°C to +125°C ; 260°C for 60 sec.